High Performance BGA (HPBGA)

Amkor's HPBGA packages offer BGA technology in a deep cavity down architecture with multiple wire bonding tiers for power, ground and signals. Providing 8 to 10 metal layers with a copper heatspreader, this package has excellent thermal performance for high power applications and is ideal for 1 mm ball pitch packaging needs.

Applications

This technology is especially applicable for your high-speed, high-power semiconductors, such as ASICs, Microprocessors, Graphic Chips, DSP and FPGA requiring high-performance packages. HPBGA technology fills the demand for speed, power and space requirements of Internet Routers, Switches, Communication Controllers, Network Servers, Wireless Base Stations, System on a Chip and other advanced end applications.

Features

• 276 - 1036 ball count
• Custom packges in body sizes ranging from 35 x 35 mm to 45 x 45 mm
• 1.0 & 1.27 mm ball pitches available
• Superior Thermal Performance
• Ideal for 1 mm pitch
• Enhanced Electrical Performance > 1 GHz
• Excellent Reliability
• 8-10 (or more) metal layers
• Sealed with liquid encapsulant
• Multiple planes for Signals, VDD, and VSS
• No encapsulation dam required - all bond tiers are within cavity
• Deep Cavity Down Architecture with Multiple Wire Bonding Tiers

Reliability:

Amkor assures you reliable performance by continuously monitoring key indices:

• Moisture sensitivity
• characterization: 30°C/60% @ 200°C Reflow, 96 hrs
• PCT: 121°C/100%/2atm, 96 hours
• Autoclave or unbiased hast: 130 °C/85% RH/96 hours
• High temp storage: 150 °C, 1000 hours
• Temp cycle: -55 °C/+125 °C, 1000 cycles

Process Highlights and Standard Materials:

• Wafer Mount: UV Tape
• Wafer Diameter: 4, 5, 6, 8 Inches
• Target Wafer Thickess: 508 µm + 70 µm, -51 µm
• Saw and Clean: CO2 Bubbler
• Die Attach/Cure: AMK-02/150°C, 30 min.
• Wire Bond: 1.0, 1.2 mil dia., Au
• Solder Balls: 63 Sn/37Pb
• Marking: Laser/Ink
• Pack / Ship Options: JEDEC trays

Biased Heatsink	Floating Heatsink