Small Form Factor Memory Cards

Model Number

SFFMC

Amkor offers the SFFMC in various formats; Laminate, Leadframe and Secure Digital Card. Amkor's SFFMC assembly and test offering supports multiple chip- and wire die and surface mount passive components in the same module and is designed for maximum customer flexibility. The LF structure supports multiple chip and wire die only. The SFFMC is constructed using conventional IC processing including wire bonding, molding and substrate infrastructure, which is then implanted into a plastic housing. The LF structure uses the existing leadframe process infrastructure. The resulting package is MCA/SDCA specification compliant, which is one of the industry standards for compact removable storage media across multiple host platforms and markets.

There are many advantages as a direct result of the flexible chip-and-wire design. One key advantage is the ability to design customer specific substrates that optimize the MMC / SDC performance per specification. The LF structure uses custom leadframes that optimize die-to-die bonding. Another direct result of the design is the superior mechanical strength. Since molding is used, there is added overall card stiffness to combat consumer handling damage. Therefore, mechanically induced damage to the card is minimized.

All formats can be designed with the capability of stacking memory die within a single footprint on the same substrate. In this manner, increased memory density can be achieved with no substrate or leadframe redesign.

Alternatively, the SFFMC can support surface mountable pre-packaged die. Thus, the die can be tested before surface mounting, resulting in guaranteed known good units going into the SFFMC assembly. The LF structure can be fully molded. The fully molded LF structure using AmKard^TM technology is the lowest cost SFFMC available. This Amkard^TM technology can be applied to many SFFMC formats (e.g. MMC, SD, RS-MMC, mini-SD, xD, Memory Stick, DUO, USB memory modules, etc.).

Applications

Amkor's SFFMC technology design is ideal for digital cameras, voice recorders, GPS navigation devices, bar code scanners, mobile phones, PDAs, MP3 players and other portable products where flash memory cards are needed. In addition, these formats can be used for I/O applications such as Bluetooth^TM WLAN, bar scanners, accelerometers, etc.

Features

Cutting edge technology and expanding package offerings provide a platform from prototype-to-production.

• Data and / or flash card supporting multiple die and SMT components (MMC / SDC currently tooled)
• MMCA / SDCA compliant
• Conventional process flow with proven process technology
• Standardized footprint
• Die stacking
• Supports pre-packaged die
• Full turnkey support
• Memory and final card test
• Labeling
• Retail packing available
• Mechanical switch option (SDC)
• Die-to-die bonding

Amkor assures a reliable performance by continuously monitoring key indices:

Design

• Substrate
• Card body and plastic housing
• Simulation

• TConsigned materials
• Turnkey solution
• Drop shipping to final customer

• Substrate IQA
• Complete solution from wafers to final modules
• Stacked die capability for higher module densities
• Option for pre-packaged pre-tested flash die
• Mechanical assembly
• Packaging and labeling for final consumer package (bubble pack)

• Design for testability support
• Test S/W and H/W development
• Test program transfer
• Wafer sort and final test capability for memory and ASIC products

Amkor can work with the customer to layout the substrate, ensure all proper interconnects are made and the required test access points are designed in.

Substrate Simulation

• De-coupling capacitors
• Ground distribution
• Cross talk
• Overshoot, undershoot and ringing
• Calculate signal delays on address, data and control lines
• Optimize CLK trace

Co-designed to insure compliance to MMCA / SDCA electrical specifications

Reliability:

Amkor assures a reliable performance by continuously monitoring key indices:

Test	Condition	Qualification
High temp storage:	85°C	500 hrs
Temp / humidity	85°C / 85% RH	500 hrs
Temperature cycle	-55°C to 85°C	40 cycles
Moisture / corrosion	Mil ST 1009	24 hrs
Bend test:	20N @ center	5x
Twist test	0.4 Nm torque	5x clockwise &  5x counterclockwise
Drop test	1.5m free fall	6 faces
Durability:	40N @ 25mm / min	10,000 insertions
Salt water spray	3% NaCl / 35°C	24 hours
WP Switch cycle - (SD Only):	Slide force 0.4N to SN	1000 yds

Process Highlights

• Die thickness (std): 280 µm
• Die attach adhesive : Dispense
• Wire bonding (std) : Au Thermosonic
• Mold: Transfer
• Package marking : Laser
• Lid attach : Adhesive (LF MMC)/Ultra sonic weld (SDC)
• Label attach : Pressure sensitive

• Substrate (MMC / SD) Thin core BT or equivalent Copper (LF)
• Solder: Lead free / Green
• Die attach adhesive : Conductive
• Au wire : 25 µm diameter
• Mold: Standard EMC
• Housing : Plastic

Cross-section MMC: