Tape-SuperBGA

Amkor's TapeSBGA technology combines SBGA thermal performance with the benefits of one metal layer flexible circuit tape. Like the SBGA package, TapeSBGA offers a high-power solution for design engineers with the additional benefits of low profile and cost effectiveness in a cavity down package.

Applications

This technology is especially applicable for your high-speed, high-power semiconductors, such as ASICs, Microprocessors, Graphic Chips, DSP and FPGA requiring high-performance packages. HPBGA technology fills the demand for high -speed, high-power, and space requirements of High end workstations, servers, data communications, PLDs (Programable Logic Devices), Cable modem controllers, digital set-top boxes (STB), internet routers and other advanced end applications.

Features

• Custom packages in body sizes ranging from 23 x 23 mm to 45 x 45 mm
• 1.0 & 1.27 mm ball pitches available
• Ball counts ranging from 168 to 1036
• Superior thermal performance - 10% better than the SBGA
• Enhanced electrical performance > 1 GHz
• Excellent reliability
• Low Profile (1.40 mm mounted)
• Facilities up to 7 ball rows
• Light weight
• Quickest design-to-prototype delivery
• Highest thermal performance, 1 Metal layer flex based cavity down BGA

• Wafer Mount: UV Tape
• Wafer Diameter: 4, 5, 6, 8 Inches
• Target Wafer Thickess: 356 µm +/-51 µm
• Saw and Clean: CO2 Bubbler
• Die Attach/Cure: AMK-02 / 150°C, 30 min.
• Substrate: Single metal layer polyimide tape
• Wire Bond: 0.8, 1.0, mil dia., Au
• Solder Balls: 63 Sn / 37 Pb
• Encapsulation/Cure: Hysol 4450SF / 110°C, 1 hour
• Marking: Laser / Ink
• Pack / Ship Options: JEDEC trays / Dry Pack Optional